Asia Express - East Asian ICT
Powerchip, IMEC to Collaborate on sub-32 Memory Technology
February 01, 2008
Following the establishment of a representative office by the Belgian IMEC (Interuniversity Microelectronics Center) in Hsinchu Science Park in Taiwan on January 22, Taiwanese Powerchip Semiconductor announced that it will be cooperating with IMEC on the development of sub-32nm memory processes, EE Times reported on January 30.

According to a report by Taiwan's Economic Daily News, Powerchip is the first Taiwanese ODM maker to have struck partnership with IMEC in terms of sub-32 memory technology. The strategic ties will enable Powerchip to reduce enormous R&D costs in this aspect. Starting in March 2008, Powerchip will assign engineers to IMEC in Belgium to participate in related R&D projects, including immersion, double patterning, and EUV lithography.

Aside from Powerchip, major international semiconductor companies including Intel, TSMC, Samsung, and Micron have established long-term R&D partnership with IMEC.